Dale Seed is a Principal Engineer at InterDigital, Inc. In this role, Dale focuses on IoT research and innovation and also participates in several M2M/IoT industry standards bodies including oneM2M, 3GPP, IETF and ETSI. He is an active contributor working to define technologies that are helping shape and enable the Internet of Things. Dale currently serves as Vice Chairman of the oneM2M Technical Plenary. Most recently, Dale also helped launch a new IoT Sustainability initiative within oneM2M and is serving as the convenor of this sub-committee. Dale is also involved in the architecture and design of IoT prototypes and collaborations with external customers and partners. As an employee of InterDigital, he is also a member of Convida Wireless which is a Joint Venture partnership between InterDigital and Sony focused on researching future IoT technology areas.